BGA Inspection Fixture
BGA is a type of packaging and testing fixture used for IC chips, primarily employed by technicians to analyze ICs in motherboard products that have failed testing.
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Keywords: PCB separation fixture, PCBA board test fixture, FCT testing equipment
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Product Description
Materials: Aluminum alloy & Antistatic Bakelite & British steel sheet GPO-3
Features: Adopts a rotary-disc structure, offering convenient operation and stable testing.
Electronic parameters
Rated current: 2 amps
Rated resistance: 80 mohms max
Bandwidth: 10.3 GHz @ -1 dB
Delay: 24 ps
Technical Requirements
Full stroke: 1.1 mm
Rated travel: 0.65mm
Rated elasticity: 22 ± 6 gf @ load 0.65 mm
Elastic life: 200,000 cycles
Features of BGA Inspection Jigs
BGA is a type of packaging and testing fixture used for IC chips, primarily designed for analyzing ICs in motherboard products that have failed testing. It serves as a tool for technicians to examine and diagnose defective ICs found in motherboards.
1. The IC pressing plate on the upper cover adopts a spin-forming structure, ensuring smooth downward pressure and uniform IC pressure without any displacement.
2. The probe’s specially shaped tip can pierce through the oxide layer on the solder ball, ensuring reliable contact without damaging the solder balls.
3. High-precision positioning slots and guide holes ensure accurate IC alignment and high testing efficiency.
4. The minimum pitch achievable is 0.4 mm (distance from pin center to pin center);
5. Probes can be selected for ICs with no signal, with signal, or at high frequency, as required.
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Chongqing Gardray Technology Co., Ltd. is a company specializing in the design and manufacture of various PCBA board test fixtures, as well as the R&D and production of FCT testing equipment.
Address: Building 15B, Qingfeng International Enterprise Port, Liandong U Valley, Shapingba District, Chongqing City
